GENERAL

If this is a reaccreditation audit, has the Supplier informed PRI of any changes of ownership, location, key personnel, or quality system?

Is there a procedure for performing preventative maintenance activity on fabrication, test and all relevant manufacturing site facilities which includes maintenance, timing, duration, coverage, and any approved Suppliers providing maintenance?

Is there a procedure for a configuration management system which address control of electronic data transfer?

GENERAL COMPLIANCE

Are process procedures at latest revision and available at point of use?

Are Customer-supplied documents on site and at latest revision?

Were the schedules, list of personnel, list of trained personnel, list of Customers, statistical techniques program, and organization chart all on site and accessible to the Auditor?

If the ability exists to have writing/change access to the operational downloaded programs, is there a control to prevent errors?

Is there objective evidence that the preventative maintenance procedure is being followed?

Is all electronic data under configuration management in accordance with the procedure?

PROCEDURE FOR PROCESS CONTROL

Does a procedure exist to monitor internal non-conformances and to initiate documented root cause analysis and corrective action?

Is there a procedure that controls the translation of the Part Number definition into shop floor instructions / programs, including the translation of Customer Part Number to shop floor Part Number?

PROCEDURE FOR PROCESS CONTROL COMPLIANCE

Is the procedure for monitoring internal non-conformances and to initiate documented root cause analysis and corrective action being followed?

Is the procedure that controls the translation of the Part Number definition into shop floor instructions/programs, including the translation of Customer Part Number to shop floor Part Number, being followed?

If  Key Process Characteristics have been created/identified, is there objective evidence of their implementation and that they are being followed?

Is the procedure for introduction of new product including manufacturing and testing capabilities to meet all Customer requirements being followed? 

If requested by Customer, is the procedure that controls and ensures that for each new product introduction an assembly and test risk analysis is performed to identify risk mitigation actions being followed?

Are the procedures for qualification of new materials, processes and equipment, including changes after first qualification, being followed?

 

CAD / CAM DATA

Is there a procedure for CAD / CAM data processing? 

CAD / CAM DATA COMPLIANCE

If there are modifications of the input CAD data for the etching process, are these modifications documented?

If required by Customer, was approval granted prior to implementation of  CAD / CAM changes beyond standard fabrication allowance?

Are the parameters clearly stated on the CAD / CAM instructions for material growth/shrink?

Do the parameters for panel configuration have clearly defined origins and offsets?

If removal of non-functional lands is being performed by CAD/CAM, is there evidence of customer approval for removal of non-functional areas?

If tear-dropping is being performed by CAD/CAM, is there evidence of customer approval for teardrop/ fillet adaptation?

MATERIAL CONTROL

GENERAL

Is there a procedure for the selection and control of material to meet the IPC requirements unless otherwise specified by the Customer?

Is there a procedure that specifies procurement from only original manufacturers or their authorized distributor unless otherwise approved by customer?

If the extension of shelf life for any material is allowed, is there a  procedure which defines the controls and limits for extension?

If the extension of floor life for any material is allowed, is there a  procedure which defines the controls and limits for extension

Is there a procedure for the monitoring and control of humidity and temperature which includes limits and defined corrective actions if limits are exceeded?

Is there evidence of compliance to the shelf life management procedure?

Is the lot number traceable to the traveler for all material constituting the PB?

Is the storage of different materials separated to avoid cross contamination?

Materials shall conform to their respective IPC specification or as specified in the procurement documentation.  (N/A applies if customer documentation requires otherwise or if material is never procured.)

If embedded device materials are procured, do they conform to requirements (IPC-4811 or IPC-4821)?

If external heat sinks or stiffeners are procured, do they conform to requirements (IPC-4101, IPC-4202, IPC-4203)?

Does copper foil conform to requirements (IPC-4562)? 

Does resin coated copper foil conform to requirements (IPC-CF-148)?

Does permanent solder mask coating conform to requirements (IPC-SM-840)?

Does bonding material (prepreg) conform to requirements (IPC-4101, IPC-4203)?

Do heatsink planes have the correct material and properties as specified in Table 3-1 of IPC-6012 or per customer requirements?

 

Prepreg

Prepreg PROCEDURE

If Prepreg shelf life is extended, is there a procedure that defines control for extension of shelf life and requires a minimum of prepreg Scaled Flow Testing per IPC-TM-650, Method 2.4.38A or Gel Time per IPC-TM-650, Method 2.3.18A to be performed to verify acceptability for use?

Audit Note: N/A applies if no Prepreg shelf life extension is allowed.    

Is there a procedure that requires that Prepreg is segregated and traceable to material manufacturer data and to any subsequent  update testing.

Is there a procedure which addresses acclimation to the point- of- use environment of material prior to processing?

Prepreg COMPLIANCE

If Prepreg shelf life is extended,

a.is there evidence the required testing has been completed?

b. Is the Prepreg segregated and traceable to the material manufacturer data and to any subsequent update test data?

Are there chart recorders or electronic data collection files for the temperature and humidity readings?

Is the environmental temperature monitored and controlled?

If environmental temperature is above 5 °C, is humidity level monitored and controlled?

Are the materials identified with expiration dates based on manufacture date?

Is there evidence that the storage practices and the indicated Prepreg shelf life dates are in accordance with the  procedure?

If there are different resins used, are they segregated?

Is material in the prepreg storage area protected from direct exposure to sun light?

Is the procedure for acclimation of Prepreg material before use being followed?

If shelf life is extended, is there evidence that prepreg Scaled Flow Testing per IPC-TM-650, Method 2.4.38A or Gel Time per IPC-TM-650, Method 2.3.18A for the Prepreg material has been performed and met the acceptance criteria?

IMAGING

Photoprocess

(NOTE:  This section covers all exposure processes, inner layer & outer layer, traditional pohotoprocess and LDI.)

Is there a procedure for all photoprocesses?

Does the procedure defines the temperature and humidity control requirements with stated levels for both, and requires to record the levels achieved over time (either electronically or by chart recorders) ?

Is there a procedure for control of airborne particulate contamination?

Is there a procedure for ensuring that each photoimageable material has specific exposure profiles.

 (Handbook:    Supplier should have different exposure setting depending on what material is being exposed .  For manual exposure, supplier should be able to show objective evidence that exposure is controlled (lamp setting and/or exposure time) and that the resulting total exposure meets material requirements (usually periodic stouffer step reading).  For automated technology such as LDI, the required total exposure is usually saved as a program, and the operator must select the correct program appropriate for the material being exposed.  Periodic verification through equipment such as stouffer step or light puck should be performed to ensure physical exposure results meet software settings. SUGGESTION on periodic definition:  if manual, once per shift.  If automated, once per month

Is there a procedure for removing static and contaminants from the surfaces of the photo tool  (artwork), tooling and imaging frame?

(Handbook:  NA if only LDI is used. )

Is there a process that ensures the integrity of the production photo tool (artwork) prior to use?

(Handbook:  NA if only LDI is used. )

If removal of resist for reprint is performed, is there a procedure for resist removal?

Is there a procedure to verify the dimensional accuracy of the photoplotter (calibrated source, AOI, or equivalent).

(NA if only LDI is being used)

Is the procedure for photoprocesses being followed?

Are there environmental controls for temperature and humidity?

Are there chart recorders or electronic data collection files for the temperature and humidity readings? 

 Are photoimageable materials being exposed per procedure?

Is there objective evidence that the integrity of the production photo tool (artwork) is being maintained as required by the process?

(Handbook:  NA if only LDI is used. )

Is there evidence that the procedure for static and contaminant removal is being followed?

Is the control and level of airborne particulate within the area per the requirements within the procedure?

Is the process to verify the dimensional accuracy of the photo plotter (a calibrated source, Automated Optical Inspection (AOI), or equivalent) being followed?

(Handbook:  NA if only LDI is used. )

Is the hold-time consistent with the photo-resist being used?

If removal of resist for reprint is performed, is it done according to procedure?

(Handbook:  NA for solder mask. )

 

Layer Develop – Etch – Strip (DES)

Developing Photoimageable Resist

[Applies to Deveoping Photoimageable Resist for Inner (DES) and Outer Layer]

Is there a procedure for developing photoimageable resist, which controls the chemistry and operating parameter used?

If more than one thickness of resist is being used, does the procedure ensure operating parameters are adjusted accordingly to achieve target break point?

Is the developing procedure being followed?

If more than one thickness of resist is used, is resist thickness verified and developed per procedure?

Is there monitoring of spray nozzles to ensure full coverage or flow?

 

Copper Etching of Inner Layers and Outer Layers

Is there a procedure for etching layers and panels, which controls the chemistry and operating parameter used?

Does the procedure ensure copper thickness is verified prior to etching, and the operating parameter adjusted accordingly to achieve target break point?

Is the etching procedure being followed?

Is the copper thickness being verified and etched according to procedure?

Are etch rates monitored and maintained within the defined limits?

Is there monitoring of spray nozzles to ensure full coverage or flow?

 

Stripping of Resist Film and Etch-Resist Plating

[Applies to stripping resist film from inner and outer Layers (DES/SES) and stripping other forms of etch-resist e.g. Tin-Strip.]

Is there a procedure for stripping resist film, which controls the chemistry and operating parameter used?

Is there a procedure for stripping other forms of etch-resist, such as tin, which controls the chemistry and operating parameter used?

Is ther a procedure that defines the method of handling inner layers after stripping of resist to minimize risks associated with handling damage?

Is the procedure for stripping resist film being followed?

Is the procedure for stripping other forms of etch-resist being followed?

Are inner layers being handled post-DES per procedure?

 

Etched Image Inspection (Manual or AOI)

Is there a procedure for etched image inspection?  

Is there a procedure defining a trigger which initiates documented corrective action when process non-conformances are found?

If AOI is performed, is there a procedure requiring that only master CAD/CAM data or engineering source files be used to generate the AOI program?

If circuit repair is performed, is there a procedure for obtaining Customer approval?

Is there a procedure for outer layer inspection? 

(NOTE:  Outer layer inspection may be done on a sample basis.)

Are inner layers inspected 100%?

Is there documentation that validates the selection of inspection techniques and equipment?

 

Is there inspection for underetch or overetch throughout the panel area?

If non-conformances are identified, is there objective evidence that the procedure for the initiation of corrective action is being followed?

If AOI is used for validation, is only engineering source file data used to generate the program?

If circuit repair is performed, was there objective evidence of prior Customer authorization?

Are line width and space parameters controlled?

Is there objective evidence that a sampling plan is being followed for outer layer?

Is there objective evidence that each inner layer is being inspected?

PERMANENT SOLDER MASK

SOLDER MASK APPLICATION

Is there a procedure for removal of contamination and copper oxidation from the board surface prior to solder mask application?

Is there a procedure for coating of Liquid Photo Imageable (LPI) solder mask?

Is there a procedure for application of Dry Film Solder mask (DFSM)?

Does the procedure address the mixing and preparation of LPI solder mask material for coating?

Does the procedure address the temperature and tack time to be used for the LPI solder mask tack dry cure cycle?

Are panels being cleaned prior to solder mask application per procedure?

Is the procedure for LPI solder mask coating being followed?

Is the procedure for DFSM application being followed?

Is the solder mask material being mixed and prepared in accordance with procedure?

Is the work-time/pot-life of the solder mask material controlled per manufacturer’s recommendations?

Is the tack dry cure of solder mask being performed per procedure?

If using batch ovens, is time compensation used if doors have been opened during the cure cycle?

If required by customer, is there verification of solder mask coverage and/or thickness?

SOLDER MASK EXPOSING

Is there a procedure for solder mask exposing?

Does the procedure define the temperature and humidity control requirements with stated levels for both, and requires to record the levels achieved over time (either electronically or by chart recorders) unless operator is prevented from exposure at out-of-spec temperature/humidity conditions?

Note: Exposure systems that automatically senses and does not allow for exposure once environmental conditions are beyond specification, such as certain LDI equipments, may be exempt from the need to record the temperature/humidity levels.  There must be a physical lockout, and cannot be in the form of an alarm or instruction.

Is there a procedure for control of airborne particulate contamination?

Is there a procedure for ensuring that each solder mask material has a specific exposure profile?

Is there a procedure for removing static and contaminants from the surfaces of the photo tool (artwork), tooling, and imaging frame?

Is there a procedure that ensures the integrity of the production photo tool (artwork) prior to use?

 

Is the procedure for solder mask exposing being followed?

Are there environmental controls for temperature and humidity?

Unless operators are prevented from exposure at out-of-spec environmental conditions, are there records of temperature and humidity readings?

Is the control and level of airborne particulate within the area per the requirements within the procedure?

Are solder mask materials being exposed per procedure?

Is the procedure for static and contaminant removal being followed?

Is there objective evidence that the integrity of the photo tool (artwork) is being maintained per procedure?

 

SOLDER MASK DEVELOP AND CURE

Is there a procedure for solder mask develop and cure?

Does the procedure define the operating parameter (e.g. conveyor speed, nozzle pressure) to be used for developing based on product and solder mask material applied?

Does the procedure define the curing parameters (temperature, time) to be used based on solder mask material?

Is there a procedure for verifying the adhesion and cure of the solder mask post-bake?

 

Is solder mask developing being performed per procedure?

Is solder mask cure being performed per procedure?

Are the ovens used for curing solder mask not used for curing another product, except for legend and marking, at the same time?

Is the verification of solder mask adhesion and cure being performed per procedure?

OXIDE COATING / OXIDE REPLACEMENT COATING

Is there a procedure for oxide coating or oxide replacement coating?

Does the procedure limit the number of rework cycles on inner layers?

OXIDE COATING/OXIDE REPLACEMENT COATING COMPLIANCE

Is there monitoring of the copper reduction through the oxide process?

If oxide coating/oxide replacement coating repair has been performed was the limitations on the maximum number of reworks adhered to?

Is the number of additional runs/rework retained for each production lot?

(NOTE:  N/A if rework is not allowed.)

MATERIAL LAY-UP AND LAMINATION

Is there a procedure clearly defining the stack-up / lay-up processes?       

Is there a procedure for each lamination method?

If laminate registration verification is not an automated calibration process, is there a procedure for laminate registration verification?

If different resin systems are simultaneously available for use, is there a procedure for storage and handling to prevent cross contamination of resins?

MATERIAL LAY-UP AND LAMINATION COMPLIANCE

Is the stack-up/lay-up being done per procedure?

Are the temperature profiles traceable to each lot processed through lamination either through chart or electronic data records?

If a vacuum system is used, are the defined vacuum levels being adhered to during the lamination process?

Is the cool-down cycle controlled?

If a post lamination bake is used to reach full cure, is there substantiation for its use based on material type?

Are lamination plates cleaned after each lamination cycle and inspected for cleanliness?

Is the lamination cycle defined and documented for each material configuration and readily available at the operation?

If a vacuum system is used, is preventative maintenance being performed?

Are the press platens profiled for temperature uniformity?

If required, is there evidence that the procedure for the prevention of cross contamination between different types of resins is being followed?

If required, is the laminate registration verified per the procedure?

DRILLING

Mechanical Drilling

Is there a procedure that covers all the drilling operations including the definition of speed and feed parameters?

Is there a procedure to address PB stack quantities and stack height parameters?

Is there a procedure which includes registration compensation?

Is there a procedure which includes first piece inspection by x-ray or other method?

NOTE:  Inspection technique must be suitable to assess internal layer registration.

Is there a procedure to address drill bit life?

Is there a system for detecting broken bits and verifying drill size?

Is there a procedure for determining conformance of PB’s experiencing broken drill bits during processing and reestablishing the drill process?

Is there a procedure for the identification and disposition of material for (e.g. lot number, panel number or location, PB serial number) nonconformances that were due to broken drill bits during processing?

Is there a procedure for the disposition of PB nonconformances that were due to broken drill bits during processing?

If resharpened drill bits are used, is there a procedure for managing and tracking the use of re-sharpened drill bits?

Mechanical Drilling COMPLIANCE

Is the drill program verified from process instructions?

Is there a vacuum system present at the hole during the drilling process?

Is there a verification of drill sizes for each lot processed?

Is there a verification of first piece for each new lot processed? 

Is there revision control of program download?

Have only engineering source file data been used to produce the drill program?

Is preventative maintenance performed on the vacuum system?

Are there records of the XY position and run-out testing for each machine as part of a scheduled maintenance? 

Is there a  registration verification used for each lot prior to production drilling?

Is the control of PBs experiencing broken drill bits during processing and the determination of their conformance being performed in accordance with the procedure?

Is the determination to continue/re-establish the drill process in accordance with the procedure?

Are the required speeds and feed parameters being used?

If XY hole-locations are allowed to be modified, are modifications within limits specified in the procedure?

Is the procedure for drill bit life being followed?

If resharpened drill bits are used, is its storage and use being tracked and managed per procedure?

Laser Drilling

Is there a procedure for laser drilling?

Is  beam focus maintained per the equipment manufacturers recommendation?

If it is not part of the automated calibration software is there a procedure for power settings based on raw material types, build-up configurations and hole diameter?

Laser Drilling COMPLIANCE

Is the drill program verified from process instructions?

Is the power level monitored for constancy?

Is the laser drilling used for blind and/or buried vias done according to the procedure?

Is there revision control of program download?

Have only engineering source file data been used to produce the drill program?

Is the laser used for drilling adjusted in terms of beam focus and power in accordance with the procedure?

Is there evidence that registration is being verified for each lot prior to production drilling?

Post-Drill Cleaning and Etchback Procedure

Is there a procedure for resin smear removal and/or etchback?                     

Post-Drill Cleaning and Etchback COMPLIANCE

If plasma etch is used, are the parameters per the procedure?

If chemical etchback is being performed, are operating parameters and chemsitry being controlled per procedure?

If  laser drilling (ablation) is performed, is there verification of capture land cleanliness?

Is there evidence that the procedure for resin smear removal and/or etchback is being followed?

COPPER PLATING

Electroless Copper/Direct Metallization

Is there a procedure for electroless copper plating and/or direct metallization?

Is there a procedure which defines the limits and frequency at which the process chemistries are to be monitored and maintained?

Is there a procedure and system in place, such as an agitation system, vibration, or ultrasonics, to eliminate bubble entrapment in the hole?

Is there a procedure in place to periodically verify that the electroless copper coverage requirements are being met prior to subsequent processing?

(NOTE:  Backlight testing, microsection, magnetic induction or other technique to confirm electroless quality shall be conducted prior to electroplating.  Any unsatisfactory findings shall result in containment of all associated panels for further screening or scrap.  Process corrective action is also indicated. )

 

Is the procedure for electroless copper plating and/or direct metallization being followed?

Are the process chemistries being monitored and maintained per the procedure?

Is there a record of the verification that the electroless copper coverage requirement is being met?

 

Electroplated Copper

Is there a procedure for electroplated copper?

Is there a procedure in place to verify that the electroplated copper thickness requirements are being met prior to subsequent processing?

Does the procedure for electroplated copper plating address control of dwell times in each process tank?

Is there a procedure for maintaining the contact conditions of the cables, cathode/anode bars, and plating jigs/racks where applicable?

Is there a procedure to for monitoring and limiting organic buildup?          

Is there a procedure which defines the frequency and operating range at which the process chemistries are to be monitored and maintained?

Is there an established limits and test frequency for ensuring that copper deposit tensile strength and elongation properties are within customer requirements?

Does the procedure define the process operating parameters to be used such as temperature, pumps, and agitation settings?

Is the procedure for electroplated copper being followed?

Are verifications of plating thickness and uniformity being performed per procedure?

Is copper tensile strength and elongation being monitored and maintained per procedure for each plating tank?

Are the cables, cathode/anode bars and plating jigs/racks being maintained per procedure where applicable?

If used, are the anode bags kept above the solution level?

Is agitation sufficient to ensure uniform plating?

(Note:  This question is primarily to ensure the auditor can issue a finding in the event of equipment failure.)

Is the copper plating bath monitored and maintained for levels of brightener, carrier, and organic contamination using hull cell analysis, Cyclic Voltammetric Stripping (CVS) Analysis, spectrographic analysis, or an alternate method of demonstrated equivalent or greater measurement sensitivity?

Are the process operating parameters, such as temperature, monitored and controlled per procedure?

Are the process chemistries being monitored, recorded, and maintained per the procedure to maintain the chemistry within the defined limits?

 

FINAL FINISHES

 

Hot Air Solder Leveling (HASL)

Hot Air Solder Leveling (HASL) Procedure

Is there a procedure for HASL? 

Is the maximum permitted thermal excursions specified and is there a mechanism for tracking the number of thermal excursions?

Is there a procedure to obtain Customer approval if the maximum number of passes through the process specified is exceeded (never to exceed 3 without Customer approval)?

Is there a procedure for the cleaning process after HASL?

Is there a procedure for preheating the panels prior to HASL to minimize thermal shock and moisture damage to the product?

(Auditor Note – Surface preparation and fluxing operations may be present between preheat and solder excursion)

Hot Air Solder Leveling (HASL) COMPLIANCE

Is there objective evidence that solder reservoir testing for copper and other impurities was performed in accordance with IPC-6012?

HANDBOOK:  IPC-6012 references J-STD-003 and J-STD-006.  J-STD-003 contains requirements for process solder.  These requirements do not apply for percent Sn, since the finish may be 50 to 70 % Sn.  However, at a minimum the supplier should demonstrate compliance to the process maximum of 0.300% Cu. 

Is there objective evidence that the monitoring of solder temperature per process lot was in accordance with the procedure?

Is the number of thermal excursions recorded as stated in the procedure?

If the maximum number of passes through the process is exceeded, was Customer approval obtained?

Is there verification of the angle and pressure of the air knives?

Is cleaning performed after HASL according to the procedure?

Are products being preheated prior to HASL per procedure?

Fused Tin Lead

Fused Tin Lead Procedure

Is there a procedure for fused tin lead finishing?

Is the maximum permitted reflow cycles specified and is there a mechanism for tracking the number of reflow cycles?

Is there a procedure to obtain Customer approval if the maximum number of reflow cycles specified is exceeded (never to exceed 3 without Customer approval)?

Is there a cleaning process for removal of flux after fusing?

Fused Tin Lead COMPLIANCE

If required by Customer,is the thickness of the fused tin lead recorded as a quality record?

If this is a hot oil reflow/fuse process,is there a preheat process?

(Note:  N/A applies if this is not a hot oil process.)

 

Is the number of reflow cycles recorded as stated in the procedure?

Is cleaning performed after fusing according to the procedure?

If the maximum number of thermal excursions is exceeded, was Customer approval obtained?

One of the following two questions (14.3.7.C or 14.3.8.C) shall be answered, both cannot be marked N/A:

If hot oil fusing is used, is the process being monitored and controlled for temperature?

If infrared fusing is used, is the process monitored for the infrared energy level?

Audit Note: N/A applies if infrared fusing is not used.

Is the final finish being evaluated with respect to wetting of the tin-lead coating? 

If manual scrubbing is used in the final clean process,is there an inspection to assure that there is no smear  between traces?

 

Electroless/Immersion Plating Final Finish

(NOTE:  14.4 questions are to be repeated for each process.)

Electroless/Immersion Plating Final Finish PROCEDURE

Is there a procedure for electroless/immersion plating final finishes?

Does the procedure establish operating parameters for all process baths including the operating temperature, agitation, pump settings, and bath dwell times as applicable?

Is there a procedure that define the limits and frequency for the monitoring and maintaining of the process chemistries within vendor specification?

Is there a procedure that defines the remake conditions for each plating bath due to max metal turnover and max allowable contamination levels.

Is the procedure for electroless/immersion plating being followed?

Are all process baths being run at the operating parameters established in the procedure?

Are all process chemistries being monitored and maintained per procedure?

Are thickness measurements being taken in-process to verify compliance and plating times?

Are plating baths being remade per procedure prior to reaching max metal turn over or max allowable contamination levels?

 

Electroplated Final Finish

(NOTE:  14.5 questions are to be repeated for each process.)

Electroplated Final Finish Procedure

Is there a procedure for electroplated final finishes?

Does the procedure establish operating parameters for all process baths including the operating temperature, agitation, pump settings, and bath dwell times as applicable?

Is there a procedure that define the frequency for the monitoring and maintaining of the process chemistries within vendor specification?

Is there a process for limiting organic build-up in the plating baths?

Is there  a process maintenance plan to ensure cathode/anode electrical contact points are clean?

Is the procedure for electroplated final finishes being followed?

Are all process baths being run at the operating parameters established in the procedure?

Are all process chemistries being monitored and maintained per procedure?

Are thickness measurements being taken on the first piece to verify compliance?

Is the process maintenance plan being followed?

Organic Solder Preservative (OSP)

Is there a procedure for the application of an OSP finish?

Is there a procedure establishing that chemical parameters are within the chemistry Suppliers’ recommendations? 

Organic Solder Preservative (OSP)

Is the bath monitored and controlled to the manufacturer’s specifications?

Is the process controlled for thickness and dwell time?

Are there deionized (DI) water rinse steps?

Is the process being monitored and controlled for temperature per manufacturer’s specifications?

Are gloves used for handling in all operations after OSP application?

 

LEGEND AND MARKING

Is there a procedure for the legend and marking?

If two-part resin systems are used, is there a procedure for mixing?

Is there a procedure for curing legend and marking?

LEGEND AND MARKING COMPLIANCE

Is there objective evidence that the procedure is being followed?

Is marking material being prepared per the manufacturer recommendation?

Are the ovens that are used for legend cure cycles not used for products, other than solder mask, at the same time?

Is the procedure for curing legend and marking being followed?

Is the work-time/pot-life of the materials controlled per manufacturer’s recommendations?

 

ROUTING AND MACHINING

Is there a procedure for the final route/contour process that addresses the following:

Cutter compensation?

Stack height parameters?

Feed and speed parameters?

Handling parameters?

Cutter size and style?

If performed, is there a procedure for performing the following operations:

17.1.7.a.P COUNTERSINK AND/OR COUNTERBORES

17.1.7.b.P EDGE CHAMFERING

17.1.7.c.P V-GROOVE SCORING

Is there a procedure which ensures that boards are handled using gloves once they have gone through final washing process?

ROUTING AND MACHINING COMPLIANCE

Is there a vacuum system present at the point of contact during the cutting process?

Is cutter wear monitored and compensated for?

Is there a verification of cutter bit size(s) and style for each lot processed?

Is there a verification of first piece set up for each new lot processed?

Is there a verification of tab size and placement per Customer requirements?

Is there a unique identification for each program?

Is there objective evidence of configuration and revision control of downloaded programs?

Is backup material used?

Are offsets, cutter feeds and speeds controlled?

Is there an inspection of the PB for countersink depth/diameter?

Is there an inspection of the PB for counterbore depth/diameter?

If chamfering is used, is there an inspection of the PB for chamfer requirements?

If the V-groove process is used, is there an inspection of the PB for V-groove depth?

Is there a process to ensure that the PB is free from FOD or contamination after manufacturing?

Are boards handled using gloves at all post-final cleaning processes per procedure?

Is preventative maintenance performed on the vacuum system?

 

ELECTRICAL TEST  – FUNCTIONAL

(HANDBOOK:  Supplier must demonstrate compliance whether testing is conducted internally or at an external lab.  Procedures for establishing test coverage, verifying compliance and correct action for noncompliance are required in all cases.)

Is there a procedure covering all means of electrical test, which include the establishment of all voltage, open and short thresholds?

Is there a procedure for the analysis of electrical test failures, which includes failure analysis, non-conformance assessment and mandates for documented corrective actions?

Is there a requirement that only engineering source file data is used to generate the Electrical Test program?

Is there a procedure for impedance testing?

Note:  A procedure is required even though the testing may not be performed in-house. 

Is there a procedure for Electrical Continuity and Isolation Resistance testing in accordance with IPC-9252?

Note:  A procedure is required even though the testing may not be performed in-house. 

If performed, is there a procedure for testing buried resistance per Customer requirements?

Note:  N/A applies only if supplier does not provide buried resistance in any product.  If the test is outsourced, a procedure is required.

If performed, is there a procedure for testing functional capacitance (buried capacitance) of a PB?

Note:  N/A applies only if supplier does not provide embedded capacitance in any product.  If the test is outsourced, a procedure is required.

ELECTRICAL TEST COMPLIANCE

One of the following two questions (19.1.C or 19.2.C) shall be answered, both cannot be marked N/A:

If net list testing is Customer supplied, are all end points tested?

If net list testing is generated internally, are all end points tested?

If required by the Customer, are all via midpoints tested?

Is the net list generated only from engineering source file data?

Is the extracted net list compared to the original data?

Are test yields monitored and reviewed?

Is there objective evidence that the review of test yields initiates appropriate corrective actions?

Is there objective evidence that all established voltage, open and short thresholds are being met?

Is there objective evidence that the tests were 100% passing, with no assumed false negatives?

NOTE:  All required nodes must be assessed.  If false negatives occur, the affected nodes must be reassessed and shown to be within specification.

If failed PB’s are reworked, have they been retested and passed all test requirements (100% coverage)?

(NOTE:  N/A only applies if rework is not allowed)

Is impedance testing being performed per procedure and customer requirements?

Note:  If testing is out-sourced, evidence of compliance shall be maintained.

Is electrical continuity and isolation testing being performed per procedure?

Note:  If testing is out-sourced, evidence of compliance shall be maintained.

If buried resistance is implemented, does the resistance meet Customer requirements?

NOTE:  N/A applies only if buried resistance is never used.

If embedded capacitance is implemented, does the capacitance meet Customer requirements?

NOTE:  N/A applies only if embedded capacitance is never used.

 

X-ray Fluorescence  (XRF)

Is there a procedure for the verifying calibration of the XRF equipment?

Is the minimum frequency of verification defined in the procedure?

Does the verification process require the use of calibration standard thicknesses consistent with the thicknesses measured on the circuits?

Is there a procedure for the management of the calibration standards?

Is there a procedure for the measurements performed with the XRF equipment?

Is the number and location of the measurements clearly defined in the procedure or inspection document?

Does the procedure ensure that the collimator is small enough and properly aligned so that the area the x-ray beam only strikes the plated area under investigation.

X-RAY FLUORESCENCE (XRF) COMPLIANCE

Is the procedure for verification being followed?

Are the calibration standards thicknesses consistent with the thicknesses measured on the circuits? 

(NOTE:  1.  The required thickness (either minimum or maximum) must fall within the range of the standards used to calibrate the equipment.

2.  Measurement of multiple plating layers requires multi-layer standards or multiple foils to represent the article under inspection. 

3. If the substrate of the calibration standard is not the same as the substrate of the material under test, the supplier must be able to demonstrate that neither substate interferes with the measurements of the plating layers.

Is the procedure for measurement being followed?

Are multiple measurement at different locations being performed per the procedure?

Is the correct collimator being used per the requirements?

Is there a certification of conformity for the calibration standards?

Microsection Sample Selection Preparation and Inspection

Section 21 of this document does not apply  if there is no reference to IPC (6012, 6013, 6018 or 2221) or Mil (Mil-P-55110, Mil-P-50884 or Mil-P-31032) in the drawing or other procurement documentation.

Section 21 requirements may be modified (marked N/A) as defined in the procurement documentation.

For the purpose of this audit, material compliant to IPC-6012 (with or without exceptions) must be selected for the job audit.

For the purpose of this audit, the most complex/challenging designs should be selected for the job audit.   (Example: high aspect ratio PTHs, microvias, embedded resistance and/or capacitance, mixed laminate, etc.)

Does the procedure require that registration be evaluated per customer requirements?  If no specific customer guidance is provided,  opposite corners of the panel should be assessed at 90 degrees. 

Does the procedure require that the structural integrity coupons be thermally stressed per IPC-TM-650 Method 2.6.8 (Solder Float) or Method 2.6.27 (Reflow at 230C or 260C) as required in the procurement documentationor per customer requirements?

Does the procedure require that the microsections include both the largest and smallest electrically functional plated through-holes (PTHs), all representative blind vias, buried vias, microvias, buried core and all combinations of stacked and buried vias unless exceptions are permitted  per customer requirements?

Does the procedure ensure that the stressed test coupons receive all the thermal excursions of the boards in addition to the thermal stress specified by the customer or per customer requirements? 

Does the procedure require that microsectioning comply to IPC-TM-650 Method 2.1.1 or 2.1.1.2 or per customer requirements?

Does the procedure require that each lot be inspected using the frequency and articles (Coupons, printed boards, etc.) as defined in table 4-3 or per customer requirements?

(Note:  Any exceptions must be indicated in the procurement documentation for an N/A to apply.)

Is there evidence that the thermal stress is performed per procedure ?

Is there evidence that the stressed test coupons receive all the required thermal excursions?

Is the microsection sample preparation procedure being followed?

Is the procedure for selecting test specimen and inspection frequency being followed?

Is there evidence that the magnification is to the specification or procurement document as required?  (Note:  Confirm magnification with calibrated stage micrometer.  Alternate evidence may be accepted.)

 

Structural Integrity

Does the procedure prohibit defects in the microsection as define by IPC-6012 and the procurement documentation?

(NOTE:  See Table 4.3 for summary of requirements.)

Does the procedure require that quality attributes be specifically verified and that compliance/noncompliance of each attribute be documented?

Does the procedure ensure that requirements that deviate from IPC-6012 are clearly apparent to the inspector and only applied to the referenced product?

Compliance to IPC-6012 and the procurement documentation shall be recorded for each lot.

Is there evidence that the microsection is being evaluated for the following items, to the correct accept/reject criteria?:

NOTE:  Sections to be inspected in unetched and etched condition.  Plating separation is often undetectable once a sample has been etched.

Annular ring (1 mil minimum or per the procurement documentation)

Plating separation and inclusions between hole wall and internal layers

Plating separation at blind and buried vias

(NOTE:  N/A applies if there are no blind or buried vias.)

Plating voids

Via Fill

Cracks and laminate voids

Smear Removal & Etchback

Plating Nodules & Plating Roughness

Copper Wrap (continuous and of the correct thickness)

Internal Conductor layer thickness?

External Conductor layer thickness?

Via plating the correct thickness (through holes, blind vias & buried vias)

HANDBOOK:  All inspection critieria were consolidated into a single question for ease of evaluation.  However, noncompliance found during microsection evaluation is usually indicative of a significant process deficiency. Each sub-question whould be considered of equal or greater importance to any other checklist question. 

MATERIALS LAB

Is there a procedure for solderability testing in compliance to J-STD-003.

Is there a procedure that requires that the electrodeposited copper be tested for tensile strength and elongation per TM-650 Method 2.4.18.1?

Is there a procedure for thermal stressing coupons or production boards in accordance with IPC-TM-650 Method 2.6.8.

Is there a procedure for testing the adhesion of solder mask per IPC-TM-650 Method 2.4.28.1.

Is there a procedure requiring boards are tested to IPC-TM-650 Method 2.3.25 paragraph 4 or to an equivalent Solvent Extract Resistivity method?        (Note:  There must be documentation supporting the equivalency of an alternate Solvent Extract Resistivity test.)

Does the procedure define the frequency of cleanliness testings?

MATERIALS LAB COMPLIANCE

Is there evidence that solderability testing is being performed in compliance to J-STD-003.

NOTE:

1)             The test specimen shall be a representative test specimen, a portion of the printed board being tested, or a whole board.

2)             The dwell time in the molten solder shall be 10.0 ± 0.5 seconds unless a part number specific requirement has been established.

3)             A minimum of 95% of each of the surfaces (i.e., each pad) being tested shall exhibit good wetting unless a part number specific requirement has been established.

If specified by the customer, is there evidence that hardness of the gold deposit meets customer specifications?

Is tensile testing being performed on the electrolytic copper plating per IPC-TM-650 2.4.18.1?

NOTE:  Certification from an external lab meets represents compliance to this requirement.  Monthly testing is not required if historic data indicates good control with no marginal results. 

Is elongation testing being performed on the electrolytic copper plating per IPC-TM-650 2.4.18.1?

NOTE:  Certification from an external lab represents compliance to this requirement.  Monthly testing is not required if historic data indicates good control with no marginal results. 

If accelerated aging is required by the customer for solderability, is the aging done in accordance with J-STD-003?

If required by the customer, is the roughness of the wire bond pads 0.8 um [32uin] or less within 80% of the maximum length of the wire bond pad? Maybe add a note to reference the IPC requirement

Is there objective evidence that coupons or production boards are being thermal stressed per IPC-TM-650 Method 2.6.8 or customer requirement.

Is there objective evidence that adhesion of solder mask is being tested per IPC-TM-650 Method 2.4.28.1.

Is the shelf life of the material being used for testing of solder mask adhesion being controlled per manufacturer’s recommendation?

Is the product tested for cleanliness per the procedure?

Is there evidence the product is tested for cleanliness at the correct frequency per the requirements?

HANDBOOK:   The contamination level shall not be greater than an equivalent of  1.56 ug/cm2 of sodium chloride unless otherwise specified by the customer.

CHEMISTRY LAB

Is there a procedural requirement that the tin/lead composition of the deposit is maintained at 50-70% Sn.

(NOTE:  N/A only applies if tin/lead finish is not used.)

Is there objective evidence that the tin/lead composition is compliant to procedural requirements?

(NOTE:  N/A only applies if tin finish is not used.)

If specified by the customer, is there evidence that the purity of the gold deposit meets customer specifications?

Is the purity of the electrolytic copper plating being maintained at minimum 99.50%?

MONTHLY QUALITY CONFORMANCE TESTING

(NOTE:  The testing in this section must be performed by a qualified lab.)

Does the procedure require that Quality Conformance Testing be completed per the following requirements:

Does the procedure require that all required coupons are submitted on a monthly basis.

Does the procedure require that test coupons of the most complex printed board of each type of material (primary resin system and primary reinforcement) processed during the month shall be selected from lots that passed acceptance testing.

NOTE: Current MIL-PRF-31032, MIL-P-55110, OR MIL-P-50884 GROUP B testing report shall be considered equivalent for some or all types of material.  Equivalency only applies if material is selected based on the guidance above.

Does the procedure require that the lab performing the Quality Conformance Testing must meet all the requirements of IPC-QL-653.

Does the procedure require that all tests listed in Table 4-4 for Class 3 are performed for each lot submitted?

Does the procedure require that test data be retained for subsequent review?

 

MONTHLY QUALITY CONFORMANCE TESTING – COMPLIANCE

Is there evidence that all requirements of the Monthly Quality Conformance Testing is being completed per the procedure?  (Complexity, frequency and all required tests)

Is there evidence that this monthly testing has been on-going since the supplier became Nadcap certified, for the last 2 years or from 6 months of the effective date of this document, whichever is most recent.

NOTE:  There is concern that some suppliers of IPC-6012 Class 3 material may not be in full compliance with respect to the Monthly Quality Conformance Testing.  The question is intended to allow Nadcap certified suppliers to become compliant to IPC-6012 Class C without penalty for past deviations.

FINAL VALIDATION

Is there a procedure for final validation?

Does the final validation procedure define the inspection and referee magnficiation to be used for visual inspection of products?

Does the final validation procedure demonstrate compliance to the Class 3 acceptance criteria of IPC-6012 or IPC-6013?

Does the final validation procedure demonstrate compliance to the acceptance criteria of the Customer or other specified requirements?

Is there training based on IPC-A-600, or equivalent workmanship standard?

Is there a process for reviewing the yield results and a method for feedback and initiating appropriate corrective actions?

Is there a procedure that defines for acceptance testing and sampling plan for each attribute of each lot of material meet the requirements of Table 4-3 or customer requirement, for Class 3 product?

FINAL VALIDATION  COMPLIANCE

Is there objective evidence that the procedure for final validation is being followed?

Is there objective evidence that the procedure for visual inspection of product being followed?

Is there objective evidence that product meets the requirements of IPC-6012 or IPC-6013?

Is there objective evidence that Customer requirements have been identified and inspected?

Are all the coupons present for examination and traceable per Customer requirements?

Are all coupons inspected, then retained or delivered as per Customer requirements?

Is there a verification of construction through micro-section analysis?  

Are there quality records for the parameters of the product [e.g. length, width, thickness, final finish, Solder Mask Over Bare Copper (SMOBC), hole sizes, hole quantities where appropriate, part number, lot number, serial number, panel position, date code, etc.]?

Is there objective evidence of the manufacturer’s identification on the product?

Is there objective evidence of process step sign-offs on the traveler (can be electronic)?

Is there objective evidence of electrical test results?

Is solderability testing for final finish performed with results recorded as a quality record?

Is adhesion testing for final plated finish performed with results recorded as a quality record as specified by contract or master drawing?

If required by Customer, is adhesion testing of solder mask being performed and the results recorded as a quality record?

If required by Customer, is adhesion for testing of legend and marking being performed and the results recorded as a quality record?

Does the final PB cleaning process meet the specified cleanliness requirements?

HANDBOOK: 

There must be documented evidence of final cleanliness for each material lot.

Cleanliness testing done immediately prior to solder mask may serve as evidence of compliance to this requirement provided strict handling protocols are in place.  As a minimum cleanliness testing must be repeated if the boards are handled without gloves.

Is there objective evidence of a valid First Article Inspection on file?

Are there records that identify scrap with each of the process steps?

Is there objective evidence of final count of the processed lot?

Is there objective evidence of final yield information per lot?

Is there objective evidence of material certifications?

Is there objective evidence of authorized repair, where required?

Is there objective evidence that the representative coupon and/or PB has met all Class 3 acceptance criteria as required by the customer?

For acceptance testing, is there evidence that the sampling for each attribute of each lot of material is being performed in compliance with Table 4-3, for Class 3 product or as required by the customer?

Do the records indicate that all samples conform to the requirements?

 

PACKAGING 

Is there a procedure for packaging to ensure compliance with Customer requirements?

If specified by the Customer, is there a procedure to manage the shelf life of finished goods?

If the shelf life of finished goods is not specified by the Customer, is there a FIFO procedure for finished goods?

NOTE:  N/A is only permitted if completed product is not stored by the supplier or if there is a specific customer requirement that conflicts with FIFO.

PACKAGING COMPLIANCE

If specified, is there evidence that the packaging is compliant to Customer requirements?

If specified by the Customer, is the procedure to manage the shelf life of finished goods being followed?

If the shelf life of finished goods in not specified by the Customer, is the FIFO procedure being followed?