Immersion Silver is typically in the thickness range of 0.125uM to 0.50uM.

Galvanic Displacement- Simply an Exchange of Copper and Silver Atoms; No Reducing Agent Required

Good for Fine Pitch Product
Planar Surface
Short, Easy Process Cycle
Eliminates Nickel
Doesn’t Affect Hole Size
Long Shelf-Life

OK for Multiple Insertions

– High Friction Coefficient; Not Suited
for Compliant-Pin Insertion (Ni-Au Pins)
– Some Systems Cannot Throw Into
Microvias with Aspect Ratios > 1:1
– Tarnishing Must be Controlled